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Design

Integrated Circuit Design with Cadence EDA Tools

Lupe

At the department of Sensor and Actuator Systems, analog and mixed-signal integrated circuits (ASICs) are developed with EDA tools from Cadence. From the specifications, ready to use mask layout data is generated.

Design and Simulation of Printed Circuit Boards (PCB)

Lupe

Prototyping and custom PCB design is based on EAGLE CAD software, whereas simulation of discrete components is performed with the free software LTSpice.

Characterization of Semiconductor Devices

Wafer-level characterization

Karl Suess PA 200 halbautomatischer Wafer-Prober (8 Zoll)
Lupe

Manual and semi-automatic (die stepping) test capability at wafer level. Probe-station PA-200 equipped with:

  • UV-Laser-Cutter for IC-Trimming und defect analysis
  • Thermo-Chuck with Wafertherm ERS SP 74A + ERS SC 507 (-20–200°C)
  • Vibration-cushoned and light-protected box with BNC/Triax interface
  • Needle card holder
  • Sony CCD Videocamera  with motorized focusing

Karl Suess PM 8, manual Wafer-Prober (6 Zoll)

Lupe

Thermo-Chuck with Wafertherm ERS SP 73 A8 (-10–140°C), with needle card holder and with vibration-cushoned and light-protected box with BNC/Triax-/Kelvin connections.

Karl Suess PSM 6 manual Wafer-Prober (6 Zoll)

Lupe

With needle card holder and with vibration-cushoned and light-protected box with BNC/Triax-/Kelvin connections.

2 pcs. Karl Suess SOM 4 manual Wafer-Prober (6 Zoll)

Lupe

Thermo-Chuck with Wafertherm ERS SP 53 A (-10–140°C), with needle card holder and with vibration-cushoned and light-protected box with BNC/Triax-/Kelvin connections.

2 pcs. Agilent B1500 Semiconductor Analyzer

Lupe

8-slots frame with following modules installed:

  • 4x B1511A Medium Power SMUs
  • 2x B1517A High-Resolution SMUs

Additional available analyzers:

Agilent 4156C (4 SMUs)
Agilent 4145b (4 SMUs, 2 monitor inputs, 2 sources)
HP 3589A (digital spectrum analyzer 10-150 MHz)

 

 

Assemply facitlity

Bonding roboter Delvotek 5630/5610

Lupe

Semi-automatic Bonder 56XX for Wedge-Wedge-bonding (5630) and Ball-Wege-bonding (5610). Standard wire dimension: 19 µm Gold- and Aluminium wires, 25 µm Aluminium wire

Bonding capability successfully proven even with chips with > 200 pads/ bonding wires.

Custom Packaging

Chip-Klebstoffe
Lupe

The department of Sensor and Actuator Systems develops chips and systems mostly for application with biological content. Therefore chemical compounds for packaging and hybridizations of semiconductors are carefully chosen. Here a short list of some of the available products: manual dispenser (Viehweg DC600), glues for assembly of chip-packages with biological compatibility with UV-, temperatur- or humidity- sensitivity, accroding to USP Class VI and ISO 10993-4/5

Zusatzinformationen / Extras

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